iNEMI
International Electronics Manufacturing Initiative
QWED is pleased to announce its membership in International Electronics Manufacturing Initiative iNEMI and its participation in iNEMI projects:
The goal of this project is to develop a guideline/best practice for a standardized measurement and test methodology that can be shared with industry and relevant standards organizations. Initial focus will be to benchmark current available test methods and provide pro/con analysis, identify gaps (if any) for extending test methods to 5G/mmWave frequencies, as well as develop reliable reference standard materials for set-up and calibration.
The project will have two distinct phases:
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Phase 1: Develop technical guidelines and generate best practices for characterization of ultra-low loss laminate materials in the range of 5-100 GHz
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Phase 2: Extend the guidelines to PCB/substrate level characterization
QWED’s contribution will mainly be concerned with its material characterization techniques and devices and where necessary to achieve project goals, also with its electromagnetic and multiphysics modelling software and expertise.
iNEMI Articles, Presentations & Posters:
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M. Celuch, M.J. Hill, T. Karpisz, M. Olszewska-Placha, S. Phommakesone, U. Ray, B. Salski, "Benchmarking of GHz resonator techniques for the characterisation of 5G/mmWave materials", 51st European Microwave Conference, London 2-6 April 2022, pp. 568-571 (copyright European Microwave Association, EuMA).
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M. Olszewska-Placha, M. Celuch, "5G Electrotnics: bridging the measurements challenges", 18th International Conference on Device Packaging, March 7-10 2022, Session "5G/MMWAVE PACKAGING: SOLVING HIGH FREQUENCY MATERIALS CHARACTERIZATION CHALLENGES".
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Presentation: M. Celuch, M. Olszewska-Placha, J. Rudnicki, "Simulation-based resonant imaging of electronic materials for enhanced design in 5G and other emerging technologies", Electronic Materials and Applications EMA 2022 virtual conference, 19-21 January 2022.
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M. Celuch, M.J. Hill, T. Karpisz, M. Olszewska-Placha, S. Phommakesone, U. Ray, B. Salski, "Bridging the materials’ permittivity traceability gap for 5G applications", IEEE International Symposium on Antennas and Propagation 2021, 4-10 December 2021 - accepted version.
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Presentation: M. Olszewska-Placha, M. Celuch, "Recent developments of resonator measurements for emerging materials and technologies", 17th International Conference on Device Packaging, April 12-15 2021, Session "5G Electronics Challanges: High Frequency Materials Characterization".
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Presentation: M. Celuch, M. Olszewska-Placha, J. Rudnicki, "How to support 5G materials measurements, antenna designs, and standards developments with QuickWave simulations", Electronic Materials and Applications EMA 2021 virtual conference, 19-22 January 2021.