ULTCC6G_EPac
Ceramika współwypalana w ultra niskiej temperaturze dla elektronicznych układów szóstej generacji (6G)

ang. Ultra-Low Temperature Co-fired Ceramics for 6th Generation Electronic Packaging
Konkurs/Call: M-ERA.NET 2 Call 2020
Instytucja finansująca/Financing Agency: Narodowe Centrum Badań i Rozwoju / National Centre for Research and Development
Krajowe Konsorcjum realizujące Projekt/ National Consortium:
Lider Konsorcjum/Consortium Leader: Sieć Badawcza Łukasiewicz - Instytutem Mikroelektroniki i Fotoniki (Ł-IMiF)
Konsorcjanci/Consortium: QWED Sp. z o.o.
Konsorcjum międzynarodowe/International Consortium:
Lider Konsorcjum/Consortium Leader: Fraunhofer Institute for Ceramic Technologies and Systems (IKTS) (DE)
Konsorcjanci/Consortium: Lukasiewicz-Instytut Mikroelektroniki I Fotoniki (L-IMiF) (PL), QWED Sp. z o.o. (PL), Laboratoire d'électronique des technologies de l'information (CEA Leti) (FR), INOVEOS (FR)
Okres realizacji/Duration: 01.09.2021 - 31.08.2024
Głównym celem projektu ULTCC6G_EPac jest wytworzenie nowych materiałów funkcjonalnych na bazie zaawansowanych technologii wielowarstwowych (ULTCC), ich charakteryzacja (np. w zakresie własności elektrycznych) oraz demonstracja ich zastosowania w wybranych urządzeniach telekomunikacyjnych.
The main objective of the ULTCC6G_EPac is to develop novel functional materials based on advanced multilayer technology (ULTCC), characterise their properties (e.g. electrical) and to demonstrate and validate the telecommunication devices based on the ULTCC6G_EPac.
ULTCC6G_EPac Events:
Articles, Presentations, Posters & Outreach:
1.
"Microwave and THz Characterization of Dielectric Properties of New ULTCC Materials for 5G and 6G Systems", Marzena Olszewska-Placha, Jobin Varghese, Dorota Szwagierczak, Janusz Rudnicki, Beata Synkiewicz-Musialska, Steffen Ziesche, 12th International Conference on Microwave Materials and their Applications, 28 September 2023
2.
Presentation: B. Salski, M. Olszewska–Placha and P. Czekala, "Microwave Characterization of Liquids with Resonant Methods", 57th Annual Microwave Power Symposium (IMPI 57) of the International Microwave Power Institute, Denver, Colorado, USA, 27-29 June 2023.
3.
Presentation: "Modelling based large surface testing of LTCC and ULTCC substrates for antenna array design", M. Olszewska–Placha, D. Szwagierczak, J. Varghese, J. Rudnicki, B. Synkiewicz Musialska, M. Ihle, S.Ziesche, IEEE MTT-S International Conference on NEMO, Canada, June 28, 2023.
4.
Say Phommakesone, Lucas Enright, Marzena Olszewska-Placha, Urmi Ray "mmWavePermittivity Standard Reference Material Development", IMS Industry Workshop IWWE6 Wednesday, 14 June 2023.
5.
Presentation: "Advances in Computational Modeling and Materials Characterization for the Microwave Power Industry",  M. Celuch, M. Olszewska–Placha, WMG-4 Workshops on International Microwave Symposium 2023, 12 June 2023.
6.
Presentation: "Benchmarking of Current Industrial Best Practices and Emerging Techniques for the Consistent Electric and Dielectric Characterisation of Materials from Microwave to Millimetre Wave Ranges", Malgorzata Celuch , Marzena Olszewska Placha, Lukasz Nowicki, Janusz Rudnicki, 1st Space Microwave Week 2023, 8-12  May 2023.
7.
Presentation: "From Computational Electromagnetics to Modelling Based Characterisation of Materials for Electronic and Energy Technologies", M. Celuch, 4th EMMC International Workshop 2023, 26-28  April 2023.
8.
Poster: "Twinned Modelling - Characterisation (MODA-CHADA) Solutions for Electronic and Energy Materials: from H2020 MMAMA and NanoBat to M-ERA.NET ULTCC6G_Epac and I4BAGS Projects", M. Celuch, M. Olszewska-Placha, J. Rudnicki and L. Nowicki, 4th EMMC International Workshop 2023, 26-28  April 2023.
9.
Presentation: "Modelling Based Characterisation of Materials from Micro to Millimetre Waves", Malgorzata Celuch, IEEE Radio & Wireless Week, Women in Microwaves Event Las Vegas, Nevada, January 22, 2023.
10.
Presentation: "Evaluation and extensions of resonator techniques for the characterization of ceramics and energy materials relevant to 6G applications", Marzena Olszewska–Placha, Malgorzata Celuch , Lukasz Nowicki, Janusz Rudnicki, Electronic Materials and Applications 2023, S21: Materials, Devices, and Applications in 6G Telecommunications, 19 January 2023.
11.
Presentation: "Microwave characterisation and modelling of materials in European initiative", M. Celuch, 2nd IEEE Ukrainian Microwave Week UkrMW, November 14-18, 2022, Online.
12.
ULTCC6G_EPac information leaflet - presented at European Microwave Week, September 26-29 2022, Milan, Italy.
13.
M. Olszewska-Placha, D. Szwagierczak, B. Synkiewicz-Musialska, J. Rudnicki, J. Kulawik, "GHz Characterisation of dielectric properties of ultra-low temperature co-fired ceramic materials for 6G systems application", 24th International Microwave and Radar Conference, 12-14 Septemeber 2022, Gdansk, Poland - poster.
14.
Marzena Olszewska-Placha, Dorota Szwagierczak, Beata Synkiewicz-Musialska, "Simulation-based resonant material measurement technique for precise characterization of LTCC and ULTCC materials towards 5G applications", 2022 IEEE MTT-S International conference on Electromagnetic and Multiphysics Modelling and Optimization (NEMO 2022), July 6-8, 2022, Limoges, France, - abstract.
15.
Presentation: B.Salski and M. Olszewska-Placha, "FDTD modeling of microwave power applicators", invited paper, 56th Annual Microwave Power Symposium (IMPI 56) of the International Microwave Power Institute, Savannah, GA, 14-16 June 2022.
16.
M. Celuch, M.J. Hill, T. Karpisz, M. Olszewska-Placha, S. Phommakesone, U. Ray, B. Salski, "Benchmarking of GHz resonator techniques for the characterisation of 5G/mmWave materials", 51st European Microwave Conference, London 2-6 April 2022, pp. 568-571 (copyright European Microwave Association, EuMA).
17.
M. Olszewska-Placha, M. Celuch, "5G Electronics: Bridging the measurement challenges", 18th International Conference on Device Packaging, March 7-10, 2022.
18.
Presentation: M. Celuch, M. Olszewska-Placha, J. Rudnicki, "Simulation-based resonant imaging of electronic materials for enhanced design in 5G and other emerging technologies", Electronic Materials and Applications EMA 2022 virtual conference, 19-21 January 2022.
19.
Presentation: M. Olszewska-Placha, "Computer modelling - a virtual laboratory for emerging technologies" at virtual IEEE Day 2021, Poland, Oct. 2021.
Acknowledgement:
ULTCC6G_EPac project is co-funded by the Polish National Centre for Research and Development under M-ERA.NET2/2020/1/2021 contract.
M-ERA.NET 2 has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 685451.